The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Mar. 24, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Jeffrey K. Jones, Chandler, AZ (US);

David F. Abdo, Scottsdale, AZ (US);

Basim H. Noori, Gilbert, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/02 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H03F 3/213 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H03F 3/193 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/5227 (2013.01); H01L 24/97 (2013.01); H01L 28/10 (2013.01); H03F 1/0288 (2013.01); H03F 1/565 (2013.01); H03F 3/193 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H03F 2200/108 (2013.01); H03F 2200/165 (2013.01); H03F 2200/171 (2013.01); H03F 2200/181 (2013.01); H03F 2200/216 (2013.01); H03F 2200/222 (2013.01); H03F 2200/225 (2013.01); H03F 2200/297 (2013.01); H03F 2200/301 (2013.01); H03F 2200/391 (2013.01); H03F 2200/42 (2013.01); H03F 2200/432 (2013.01); H03F 2200/451 (2013.01); H03F 2200/48 (2013.01); H03F 2200/75 (2013.01); H03F 2203/21103 (2013.01); H03F 2203/21106 (2013.01); H03F 2203/21112 (2013.01); H03F 2203/21139 (2013.01); H03F 2203/21142 (2013.01); H03F 2203/21157 (2013.01);
Abstract

An amplifier includes a semiconductor substrate. A first conductive feature partially covers the bottom substrate surface to define a conductor-less region of the bottom substrate surface. A first current conducting terminal of a transistor is electrically coupled to the first conductive feature. Second and third conductive features may be coupled to other regions of the bottom substrate surface. A first filter circuit includes an inductor formed over a portion of the top substrate surface that is directly opposite the conductor-less region. The first filter circuit may be electrically coupled between a second current conducting terminal of the transistor and the second conductive feature. A second filter circuit may be electrically coupled between a control terminal of the transistor and the third conductive feature. Conductive leads may be coupled to the second and third conductive features, or the second and third conductive features may be coupled to a printed circuit board.


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