Cory Wajda

USPTO Granted Patents = 29 (Patent Applications = 7)

Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 116(Granted Patents)

Location History:

Mesa, AZ (US) (2002 - 2009)
Hopewell Junction, NY (US) (2008 - 2013)
Sand Lake, NY (US) (2007 - 2020)
Albany, NY (US) (2017 - 2023)

Company Filing History:

28 out of 10,295

Tokyo Electron Limited

patents

7 out of 164,108

International Business Machines Corporation

patents

where one patent can have more than one assignee

Years Active: 2002-2025

where 'Filed Patents' based on already Granted Patents

29 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12482667 - Thermal etching of ruthenium (2025-11-25),

2. 12237216 - Method for filling recessed features in semiconductor devices with a low-resistivity metal (2025-02-25),

3. 11700778 - Method for controlling the forming voltage in resistive random access memory devices (2023-07-11),

4. 11621190 - Method for filling recessed features in semiconductor devices with a low-resistivity metal (2023-04-04),

5. 11024535 - Method for filling recessed features in semiconductor devices with a low-resistivity metal (2021-06-01),

6. 10991881 - Method for controlling the forming voltage in resistive random access memory devices (2021-04-27),

7. 10950460 - Method utilizing using post etch pattern encapsulation (2021-03-16),

8. 10700009 - Ruthenium metal feature fill for interconnects (2020-06-30),

9. 10157784 - Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization (2018-12-18),

10. 10068764 - Selective metal oxide deposition using a self-assembled monolayer surface pretreatment (2018-09-04),

11. 10056328 - Ruthenium metal feature fill for interconnects (2018-08-21),

12. 10008564 - Method of corner rounding and trimming of nanowires by microwave plasma (2018-06-26),

13. 9711449 - Ruthenium metal feature fill for interconnects (2017-07-18),

14. 9607888 - Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling (2017-03-28),

15. 8722548 - Structures and techniques for atomic layer deposition (2014-05-13),

Title: The Inventive Journey of Cory Wajda

Introduction: Cory Wajda, a talented inventor hailing from Sand Lake, NY (US), has made significant contributions to the world of innovation with his creative mind and dedication to problem-solving.

Latest Patents: Cory Wajda's latest patents include groundbreaking designs in the field of renewable energy technology, particularly focusing on solar panel efficiency and energy storage solutions.

Career Highlights: Throughout his career, Cory Wajda has been recognized for his innovative spirit and has received multiple awards for his inventions, showcasing his commitment to pushing the boundaries of technological advancement.

Collaborations: Cory Wajda has collaborated with leading research institutions and universities to further develop his inventions, demonstrating his ability to work effectively in multidisciplinary teams to bring his ideas to life.

Conclusion: Cory Wajda's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors, leaving a lasting impact on the world of technology and beyond.

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7 patents pending:

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