The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Mar. 07, 2022
Tokyo Electron Limited, Tokyo, JP;
Kai-Hung Yu, Albany, NY (US);
Shihsheng Chang, Albany, NY (US);
Ying Trickett, Albany, NY (US);
Eric Chih-Fang Liu, Albany, NY (US);
Yun Han, Albany, NY (US);
Henan Zhang, Albany, NY (US);
Cory Wajda, Albany, NY (US);
Robert D. Clark, Albany, NY (US);
Gerrit J. Leusink, Albany, NY (US);
Gyanaranjan Pattanaik, Albany, NY (US);
Hiroaki Niimi, Albany, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method for filling recessed features with a low-resistivity metal. The method includes providing a patterned substrate containing a recessed feature formed in a first layer and a second layer that is exposed in the recessed feature, forming a nucleation enhancement layer on a sidewall of the first layer in the recessed feature and depositing a metal layer in the recessed feature by vapor phase deposition, where the metal layer is deposited on the second layer and on the nucleation enhancement layer. An initial metal layer may be selectively formed on the second layer in the recessed feature before forming the nucleation enhancement layer.