Ying Trickett

Title: Innovations of Inventor Ying Trickett

Introduction

Ying Trickett is a notable inventor based in Albany, NY (US), recognized for his contributions to semiconductor technology. With a total of three patents to his name, he has made significant advancements in methods for processing materials in semiconductor devices.

Latest Patents

One of Ying Trickett's latest patents is titled "Method for filling recessed features in semiconductor devices with a low-resistivity metal." This innovative method involves providing a patterned substrate with a recessed feature, forming a nucleation enhancement layer, and depositing a metal layer through vapor phase deposition. Another significant patent is "Platform and method of operating for integrated end-to-end CMP-less interconnect process." This patent describes a method of processing materials on a semiconductor workpiece using an integrated sequence of steps executed on a common manufacturing platform, ensuring a controlled environment throughout the process.

Career Highlights

Ying Trickett has worked with prominent companies in the semiconductor industry, including Tokyo Electron Limited. His experience in these organizations has contributed to his expertise in semiconductor manufacturing processes and innovations.

Collaborations

Throughout his career, Ying Trickett has collaborated with notable professionals in the field, including Kai-Hung Yu and Kaoru Maekawa. These collaborations have likely enhanced his work and contributed to the development of his patented technologies.

Conclusion

Ying Trickett's contributions to semiconductor technology through his patents and career experiences highlight his role as an influential inventor in the industry. His innovative methods continue to impact the field of semiconductor manufacturing.