The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Jul. 17, 2017
Applicant:
Tokyo Electron Limited, Minato-ku, Tokyo, JP;
Inventors:
Kai-Hung Yu, Watervliet, NY (US);
Gerrit J. Leusink, Rexford, NY (US);
Cory Wajda, Sand Lake, NY (US);
Tadahiro Ishizaka, Hokuto, JP;
Takahiro Hakamata, Albany, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76814 (2013.01); H01L 21/76826 (2013.01); H01L 21/76879 (2013.01); H01L 21/76882 (2013.01); H01L 23/53242 (2013.01); H01L 21/28556 (2013.01); H01L 21/28562 (2013.01); H01L 21/76876 (2013.01);
Abstract
A method is provided for at least partially filling a feature in a substrate. The method includes providing a substrate containing a feature, depositing a ruthenium (Ru) metal layer to at least partially fill the feature, and heat-treating the substrate to reflow the Ru metal layer in the feature.