The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Oct. 10, 2019
Tokyo Electron Limited, Tokyo, JP;
Kai-Hung Yu, Albany, NY (US);
David O'Meara, Albany, NY (US);
Nicholas Joy, Albany, NY (US);
Gyanaranjan Pattanaik, Albany, NY (US);
Robert Clark, Fremont, CA (US);
Kandabara Tapily, Albany, NY (US);
Takahiro Hakamata, Albany, NY (US);
Cory Wajda, Albany, NY (US);
Gerrit Leusink, Albany, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method for filling recessed features with a low-resistivity metal. The method includes providing a patterned substrate containing a recessed feature formed in a first layer and a second layer that is exposed in the recessed feature, and pre-treating the substrate with a surface modifier that increases metal deposition selectivity on the second layer relative to on the first layer, depositing a metal layer on the substrate by vapor phase deposition, where the metal layer is preferentially deposited on the second layer in the recessed feature, and removing metal nuclei deposited on the first layer, including on a field area and on sidewalls of the first layer in the recessed feature, to selectively form the metal layer on the second layer in the recessed feature. The steps of pre-treating, depositing and removing may be repeated at least once to increase a thickness of the metal layer in the recessed feature.