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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Chun-Wei Chia

This inventor holds 19 USPTO granted patents and 7 published patent applications, primarily in Image Sensor Technology. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Wei Chia. Retrieved from https://idiyas.com/inventor/chun-wei-chia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Kaohsiung, TW (2018 - 2023)
  • Hsinchu, TW (2023)

Company Filing History:

goldMedal19 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2018-2026

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Areas of Expertise:
Image Sensor
Dark Current Sensing
Stress Releasing Structure
Crosstalk Reduction
Multi-layer Structure
Trench Isolation
Polysilicon Gate
Daisy-chain Seal Ring
Wafer Cracking
Electromagnetic Radiation Detection
Manufacturing Method
Isolation Structure
19 patents (USPTO):Explore Patents
1. 12648239 - Multi-layer image sensor structure with dark current sensing photodiodes in black level calibration area surrounded by dual seal ring system and opaque cover with integrated trench isolation (2026-06-02),
2. 12490535 - CMOS image sensor and method for making the same (2025-12-02),
3. 12224297 - Method of forming an image sensor having stress releasing structure (2025-02-11),
4. 12211862 - Multi-protrusion transfer gate manufacturing method (2025-01-28),
5. 12211805 - Trench structure for reduced wafer cracking (2025-01-28),
6. 12176361 - Electromagnetic radiation detection method (2024-12-24),
7. 12170234 - Daisy-chain seal ring structure (2024-12-17),
8. 11837622 - Image sensor comprising polysilicon gate electrode and nitride hard mask (2023-12-05),
9. 11756842 - Daisy-chain seal ring structure (2023-09-12),
10. 11569289 - Image sensor having stress releasing structure and method of forming same (2023-01-31),
11. 11569288 - Image sensor having stress releasing structure and method of forming same (2023-01-31),
12. 11521997 - Multi-protrusion transfer gate structure (2022-12-06),
13. 11444116 - Method for forming image sensor (2022-09-13),
14. 11164902 - Image sensor having isolation structure (2021-11-02),
15. 10985199 - Image sensor having stress releasing structure and method of forming same (2021-04-20),

Title: Chun-Wei Chia: Innovator from Kaohsiung

Introduction: Chun-Wei Chia is a renowned inventor hailing from Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chun-Wei Chia holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Chun-Wei Chia has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries.

Collaborations: Throughout his career, Chun-Wei Chia has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing.

Conclusion: Chun-Wei Chia's dedication to pushing the boundaries of technology and his passion for creating a sustainable future make him a true visionary in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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