The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Nov. 11, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kun-Huei Lin, Hsinchu, TW;

Yun-Wei Cheng, Hsinchu, TW;

Chun-Hao Chou, Hsinchu, TW;

Kuo-Cheng Lee, Hsinchu, TW;

Chun-Wei Chia, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G01R 29/08 (2006.01); H01L 27/02 (2006.01); H01L 29/423 (2006.01); H04N 25/00 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14614 (2013.01); G01R 29/08 (2013.01); H01L 27/0203 (2013.01); H01L 27/14603 (2013.01); H01L 27/14612 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 29/4236 (2013.01); H01L 27/14605 (2013.01); H01L 2924/13081 (2013.01); H04N 25/00 (2023.01);
Abstract

A method of manufacturing a transistor structure includes forming a plurality of trenches in a substrate, lining the plurality of trenches with a dielectric material, forming first and second substrate regions at opposite sides of the plurality of trenches, and filling the plurality of trenches with a conductive material. The plurality of trenches includes first and second trenches aligned between the first and second substrate regions, and filling the plurality of trenches with the conductive material includes the conductive material extending continuously between the first and second trenches.


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