Chih-Hsien Lin

This inventor holds 38 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Asia Optical International Ltd., Sintai Optical (Shenzhen) Co., Ltd.. Active years: 2002-2025.

USPTO Granted Patents = 38 (Patent Applications = 3)

% Patents Active = 89.5

Average Co-Inventor Count = 4.1

ph-index = 10

Forward Citations = 259(Granted Patents)

Location History:

Taichung, JP (2017)
Hsin-Chu, TW (2002 - 2023)
Tai-Chung, TW (2013 - 2023)
Tainan, TW (2007 - 2024)

Company Filing History:

35 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 82

Asia Optical International Ltd.

patents

3 out of 220

Sintai Optical (Shenzhen) Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 2002-2025

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Areas of Expertise:

Integrated Fan-Out Packages

Circuit Test Structure

Electrostatic Discharge Protection

Three Dimensional Integrated Circuit

Redistribution Layer

Passivation Layer

Silicon Vias

Microelectronic Fabrication

Capacitor Structure

Adhesion Enhancement

MIM Capacitor

Wiring Defects

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12354959 - Redistribution layer features (2025-07-08),

2. 12322742 - Semiconductor structure and manufacturing method thereof (2025-06-03),

3. 12253558 - Circuit test structure and method of using (2025-03-18),

4. 12051622 - Passivation layer and planarization layer and method of forming the same (2024-07-30),

5. 11855066 - Semiconductor structure and manufacturing method thereof (2023-12-26),

6. 11828790 - Circuit test structure and method of using (2023-11-28),

7. 11670594 - Redistribution layer features (2023-06-06),

8. 11335672 - Semiconductor structure and manufacturing method thereof (2022-05-17),

9. 11002788 - Circuit test structure (2021-05-11),

10. 10879162 - Integrated fan-out packages (2020-12-29),

11. 10741537 - Semiconductor structure and manufacturing method thereof (2020-08-11),

12. 10347574 - Integrated fan-out packages (2019-07-09),

13. 10288676 - Circuit test structure (2019-05-14),

14. 10269586 - Package structure and methods of forming same (2019-04-23),

15. 10168124 - Trajectory prediction system (2019-01-01),

Title: Chih-Hsien Lin: Innovator from Tai-Chung

Introduction: Chih-Hsien Lin is a renowned inventor hailing from Tai-Chung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chih-Hsien Lin holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Chih-Hsien Lin has worked with leading tech companies, research institutions, and universities, where he has spearheaded numerous projects that have revolutionized the industry.

Collaborations: Throughout his career, Chih-Hsien Lin has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing that has led to groundbreaking inventions.

Conclusion: Chih-Hsien Lin's passion for innovation, coupled with his relentless drive to push the boundaries of technology, has solidified his position as a trailblazer in the world of inventions and patents.