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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12253558 B1

PDFFull Text
Date of Patent:
Mar. 18, 2025

Filed:

Nov. 22, 2023

Circuit test structure and method of using

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ching-Fang Chen, Hsinchu, TW;

Hsiang-Tai Lu, Hsinchu, TW;

Chih-Hsien Lin, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Igwe U Anya

Int. Cl.
CPC ...
H01L 23/00 (2006.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2856 (2013.01); G01R 31/2886 (2013.01); H01L 22/34 (2013.01); H01L 23/12 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A circuit test structure includes a chip including a conductive line which traces a perimeter of the chip. The circuit test structure further includes an interposer electrically connected to the chip, wherein the conductive line is over both the chip and the interposer. The circuit test structure further includes a test structure connected to the conductive line. The circuit test structure further includes a testing site, wherein the test structure is configured to electrically connect the testing site to the conductive line.

Find Patent Forward Citations

Chen, Ching-Fang. (2025). Circuit test structure and method of using (U.S. Patent No. 12253558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12253558

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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