logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11828790 B1

PDFFull Text
Date of Patent:
Nov. 28, 2023

Filed:

Apr. 13, 2021

Circuit test structure and method of using

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ching-Fang Chen, Hsinchu, TW;

Hsiang-Tai Lu, Hsinchu, TW;

Chih-Hsien Lin, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Igwe U Anya

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2856 (2013.01); G01R 31/2886 (2013.01); H01L 22/34 (2013.01); H01L 23/12 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A circuit test structure includes an interposer for electrically connecting to a chip, wherein the interposer includes a conductive line, and the conductive line extends along at least two side of the interposer. The circuit test structure further includes a plurality of electrical connections to the conductive line. The circuit test structure further includes a testing site electrically connected to the conductive line, wherein the testing site is on an opposite surface of the interposer from the plurality of electrical connections.

Find Patent Forward Citations

Chen, Ching-Fang. (2023). Circuit test structure and method of using (U.S. Patent No. 11828790). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11828790

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…