EPO Patents = 2

Average Co-Inventor Count = 5.1

ph-index = 8

Forward Citations = 222(Granted Patents)

Location History:

Gilbert, AZ (US) (2003 - 2009)
Queen Creek, AZ (US) (2008 - 2018)

Company Filing History:

15 out of 5,491

Freescale Semiconductor,inc.

patents

7 out of 349

Everspin Technologies, Inc.

Years Active: 2003-2018

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24 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10103088 - Integrated antenna for direct chip attach connectivity module package structures (2018-10-16),

2. 8984379 - MRAM field disturb detection and recovery (2015-03-17),

3. 8236578 - Electronic device including a magneto-resistive memory device and a process for forming the electronic device (2012-08-07),

4. 8119424 - Electronic device including a magneto-resistive memory device and a process for forming the electronic device (2012-02-21),

5. 7833806 - Structure and method for fabricating cladded conductive lines in magnetic memories (2010-11-16),

6. 7602177 - Sensor having moveable cladding suspended near a magnetic field source (2009-10-13),

7. 7494825 - Top contact alignment in semiconductor devices (2009-02-24),

8. 7476329 - Methods for contacting conducting layers overlying magnetoelectronic elements of MRAM devices (2009-01-13),

9. 7445943 - Magnetic tunnel junction memory and method with etch-stop layer (2008-11-04),

10. 7279341 - Method for fabricating a flux concentrating system for use in a magnetoelectronics device (2007-10-09),

11. 7169622 - Magnetoresistive random access memory devices and methods for fabricating the same (2007-01-30),

12. 7105903 - Methods and structures for electrical communication with an overlying electrode for a semiconductor element (2006-09-12),

13. 7105363 - Cladded conductor for use in a magnetoelectronics device and method for fabricating the same (2006-09-12),

14. 7087972 - Magnetoelectronic devices utilizing protective capping layers and methods of fabricating the same (2006-08-08),

15. 7042025 - Method and structure for contacting an overlying electrode for a magnetoelectronics element (2006-05-09),

Title: **Brian R Butcher: Innovator in Microelectronic Packaging and Memory Technologies**

Introduction

Brian R Butcher is a notable inventor based in Gilbert, AZ, recognized for his substantial contributions to the fields of microelectronics and memory technologies. With an impressive portfolio comprising 24 patents, Butcher has made significant strides in advancing device connectivity and functionality in the semiconductor industry.

Latest Patents

Among his latest innovations, Brian Butcher has patented technologies that include an integrated antenna for direct chip attach connectivity module package structures. This patent describes methods for forming microelectronic package structures that feature a die on a first substrate, with components embedded in a molding material. The design ensures that these components are fully encapsulated, providing durability and reliability. Another recent patent pertains to MRAM field disturb detection and recovery. This invention details processes and devices for accurately reading data from an Error Correction Code (ECC) word, detecting double bit errors, and resetting reference bits, enhancing the efficiency of memory devices.

Career Highlights

Brian R Butcher has made significant contributions through his work at leading technology companies. Notably, he has been associated with Freescale Semiconductor, Inc. and Everspin Technologies, Inc. His roles in these organizations have allowed him to lead innovative projects that underscore his expertise in microelectronics and memory systems.

Collaborations

Throughout his career, Brian has collaborated with talented individuals, including Gregory W Grynkewich and Mark A Durlam. These partnerships have contributed to the development of groundbreaking technologies and have facilitated knowledge exchange within the microelectronics community.

Conclusion

Brian R Butcher stands out as a key figure in the realm of semiconductor innovation. His extensive patent portfolio and collaborative efforts reinforce his status as a leader in developing advanced microelectronic packaging and memory solutions. As technology continues to evolve, his contributions will undoubtedly play a pivotal role in shaping the future of the industry.

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2 patents (EPO):

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