Bok Eng Cheah

Bukit Gambir, Malaysia

Bok Eng Cheah

This inventor holds 146 USPTO granted patents and 46 published patent applications and 5 EPO patents, primarily in Semiconductor Packaging (CPC class H01L24-16). Top assignees: Intel Corporation, Altera Corporation. Active years: 2008-2026. Education: Universiti Sains (Malaysia).

Graduated from:
  • Universiti Sains (Malaysia)
USPTO Granted Patents = 146 

% Patents Active = 84.9

 

Average Co-Inventor Count = 4.2

ph-index = 9

Forward Citations = 432(Granted Patents)

Forward Citations (Not Self Cited) = 335(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Teluk Kumbar, MY (2010)
  • Gellugor, MY (2021)
  • Gelugor, MY (2016 - 2022)
  • Bayan Lepas, MY (2015 - 2023)
  • Pinang, MY (2022 - 2023)
  • Penang, MY (2008 - 2024)
  • Bukit Gambir, MY (2018 - 2024)
  • Gelugor Pulau Pinang, MY (2022 - 2024)
  • Geulgor, MY (2023 - 2024)

Company Filing History:


Years Active: 2008-2026

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Areas of Expertise:
Vertical Interconnects
Memory Devices
3D Packaging
Integrated Circuit
Hybrid Boards
Signal Integrity
Electrical Performance
Miniaturization
Interposer Structures
Die-to-Die Interconnects
Stacked Components
Crosstalk Mitigation
146 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Bok Eng Cheah

Introduction

Bok Eng Cheah is a prominent inventor based in Bukit Gambir, Malaysia. He has made significant contributions to the field of electronics, holding an impressive total of 136 patents. His work focuses on enhancing device miniaturization and improving electrical performance in circuit boards.

Latest Patents

Among his latest patents is the invention titled "Recessed vertical interconnects for device miniaturization." This patent describes an electronic assembly that includes a package substrate with a first surface and an opposing second surface. It features a first interconnect that extends between these surfaces, which comprises a first recessed side wall, and a second interconnect arranged adjacent to it. Another notable patent is "Asymmetrical laminated circuit boards for improved electrical performance." This invention relates to a printed circuit board assembly that includes two circuit boards with vertical vias and an adhesive layer coupling them, aimed at enhancing electrical performance.

Career Highlights

Bok Eng Cheah has worked with leading companies in the technology sector, including Intel Corporation and Exo Imaging, Inc. His experience in these organizations has allowed him to develop innovative solutions that address complex challenges in electronics.

Collaborations

Throughout his career, Bok has collaborated with talented individuals such as Jackson Chung Peng Kong and Kooi Chi Ooi. These partnerships have contributed to the advancement of his projects and innovations.

Conclusion

Bok Eng Cheah's contributions to the field of electronics through his numerous patents and collaborations highlight his role as a key innovator. His work continues to influence the industry and pave the way for future advancements.

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