Bok Eng Cheah

Bukit Gambir, Malaysia

Bok Eng Cheah

Graduated from:
  • Universiti Sains (Malaysia)
USPTO Granted Patents = 136 

 

Average Co-Inventor Count = 4.2

ph-index = 9

Forward Citations = 397(Granted Patents)

Forward Citations (Not Self Cited) = 335(Dec 10, 2025)



Location History:

  • Teluk Kumbar, MY (2010)
  • Gellugor, MY (2021)
  • Gelugor, MY (2016 - 2022)
  • Bayan Lepas, MY (2015 - 2023)
  • Pinang, MY (2022 - 2023)
  • Penang, MY (2008 - 2024)
  • Bukit Gambir, MY (2018 - 2024)
  • Gelugor Pulau Pinang, MY (2022 - 2024)
  • Geulgor, MY (2023 - 2024)

Company Filing History:


Years Active: 2008-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Vertical Interconnects
Circuit Boards
Semiconductor Packaging
Micro Through-Silicon Vias
Integrated Circuit Packages
3D Packaging
Signal Integrity
Embedded Components
Die-To-Die Interconnects
Hybrid Interconnects
Power Delivery
Electrical Shielding
136 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Bok Eng Cheah

Introduction

Bok Eng Cheah is a prominent inventor based in Bukit Gambir, Malaysia. He has made significant contributions to the field of electronics, holding an impressive total of 136 patents. His work focuses on enhancing device miniaturization and improving electrical performance in circuit boards.

Latest Patents

Among his latest patents is the invention titled "Recessed vertical interconnects for device miniaturization." This patent describes an electronic assembly that includes a package substrate with a first surface and an opposing second surface. It features a first interconnect that extends between these surfaces, which comprises a first recessed side wall, and a second interconnect arranged adjacent to it. Another notable patent is "Asymmetrical laminated circuit boards for improved electrical performance." This invention relates to a printed circuit board assembly that includes two circuit boards with vertical vias and an adhesive layer coupling them, aimed at enhancing electrical performance.

Career Highlights

Bok Eng Cheah has worked with leading companies in the technology sector, including Intel Corporation and Exo Imaging, Inc. His experience in these organizations has allowed him to develop innovative solutions that address complex challenges in electronics.

Collaborations

Throughout his career, Bok has collaborated with talented individuals such as Jackson Chung Peng Kong and Kooi Chi Ooi. These partnerships have contributed to the advancement of his projects and innovations.

Conclusion

Bok Eng Cheah's contributions to the field of electronics through his numerous patents and collaborations highlight his role as a key innovator. His work continues to influence the industry and pave the way for future advancements.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…