The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jul. 06, 2021
Intel Corporation, Santa Clara, CA (US);
Bok Eng Cheah, Gelugor, MY;
Chia Chuan Wu, Butterworth, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Kooi Chi Ooi, Bukit Gambir, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
According to various examples, a device is described. The device may include a first package substrate. The device may also include a first mold layer with a first thickness. The device may also include a second mold layer with a second thickness proximal to the first mold layer. The second thickness may be larger than the first thickness. The first mold layer may include a plurality of first interconnects coupled to the first package substrate. The second mold layer may include a plurality of second interconnects configured to couple the first package substrate to a printed circuit board.