Jackson Chung Peng Kong

Title: Jackson Chung Peng Kong: Pioneering Innovations in Semiconductor Packaging

Introduction:

In the fast-paced world of semiconductor technology, inventors play a crucial role in pushing the boundaries of efficiency and performance. Among these talented individuals, Jackson Chung Peng Kong has emerged as a noteworthy innovator, with numerous patents to his credit. Based in Tanjung Tokong, Malaysia, Jackson is a key contributor at Intel Corporation, one of the leading giants in the semiconductor industry. Let's explore some of his recent patents and shed light on his remarkable achievements in the field.

Overview of Patents:

With an impressive total of 94 patents to his name, Jackson Chung Peng Kong has left an indelible mark in the realm of semiconductor packaging. Two of his latest patents are of particular interest: "Embedded Reference Layers for Semiconductor Package Substrates" and "Micro Through-Silicon Via for Transistor Density Scaling."

1. Embedded Reference Layers for Semiconductor Package Substrates:

This patent revolves around the implementation of two conductive reference layers within a semiconductor package substrate. By integrating these embedded reference layers, Jackson aims to mitigate electromagnetic noise coupling between adjacent signals in semiconductor device packages. This innovation ensures improved signal integrity and enhanced performance, particularly in high-frequency applications.

2. Micro Through-Silicon Via for Transistor Density Scaling:

Jackson's second recent patent focuses on enhancing transistor density scaling through the utilization of micro through-silicon vias (TSVs). This technology involves the integration of stacked TSVs in an electronic device's integrated circuit (IC) die, enabling improved connectivity and reducing power consumption. By incorporating buried silicon via (BSV) portions with varying widths, this innovation optimizes the use of available space while maintaining high circuit density.

Works at Intel Corporation:

As a vital member of the Intel Corporation team, Jackson Chung Peng Kong plays an instrumental role in driving innovation within the company. Intel Corporation, commonly known as Intel, is a globally renowned technology company specializing in the design and manufacture of semiconductor chips and related products. With a rich history of groundbreaking inventions, Intel continues to shape the future of computing and technological advancements.

Collaborators:

In the world of innovation, collaboration is often the key to success. Jackson has had the privilege of working alongside esteemed colleagues at Intel Corporation, including Bok Eng Cheah and Kooi Chi Ooi. These talented individuals contribute their expertise to the development of new ideas and technologies, fostering a dynamic and innovative work environment.

Conclusion:

Inventor extraordinaire Jackson Chung Peng Kong's relentless pursuit of excellence in semiconductor packaging has led to significant advancements in the field. Through his patents, such as the embedded reference layers and micro TSVs, Jackson has substantially contributed to enhancing signal integrity, improving transistor density scaling, and promoting overall efficiency in semiconductor devices. As part of Intel Corporation's esteemed team, Jackson continues to shape the future of the semiconductor industry, pushing the boundaries of innovation and paving the way for new technological possibilities.