The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Aug. 25, 2021
Intel Corporation, Santa Clara, CA (US);
Bok Eng Cheah, Pulau Pinang, MY;
Seok Ling Lim, Kulim Kedah, MY;
Jenny Shio Yin Ong, Pulau Pinang, MY;
Jackson Chung Peng Kong, Pulau Pinang, MY;
Kooi Chi Ooi, Pulau Pinang, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
The present disclosure is directed to multichip semiconductor packages, and methods for making them, which includes a package substrate with an integrated bridge frame having a first horizontal portion positioned on a top surface of the package substrate, with first and second dies positioned overlapping the first horizontal portion of the bridge frame, and a second horizontal portion positioned on the bottom surface of the package substrate, with third and fourth dies positioned overlapping the second horizontal portion of the bridge frame. The bridge frame further includes first and second vertical portions separated by a portion of the package substrate positioned under the first horizontal portion of the bridge frame between the top surface and bottom surfaces of the package substrate, and a plurality of vertical interconnects adjacent to the first and second vertical portions of the bridge frame.