IDiyas

For the Inventor, By the Inventor

Bayan Lepas, Malaysia

Jenny Shio Yin Ong

USPTO Granted Patents = 43 

Average Co-Inventor Count = 4.3

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Bayna Lepas, MY (2021)
  • Payan Lepas Pulau Pinang, MY (2022)
  • Pinang, MY (2022 - 2023)
  • Bayan Lepas, MY (2015 - 2024)
  • Bayan Lepas Pulau Pinang, MY (2022 - 2024)

Company Filing History:

goldMedal43 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2015-2025

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43 patents (USPTO):
1. 12328816 - Asymmetrical laminated circuit boards for improved electrical performance (2025-06-10),
2. 12256487 - Hybrid boards with embedded planes (2025-03-18),
3. 12218064 - Molded silicon interconnects in bridges for integrated-circuit packages (2025-02-04),
4. 12191281 - Multi-chip package with recessed memory (2025-01-07),
5. 12183722 - Molded interconnects in bridges for integrated-circuit packages (2024-12-31),
6. 12142570 - Composite bridge die-to-die interconnects for integrated-circuit packages (2024-11-12),
7. 12002747 - Integrated bridge for die-to-die interconnects (2024-06-04),
8. 11955431 - Interposer structures and methods for 2.5D and 3D packaging (2024-04-09),
9. 11887940 - Integrated circuit packages with conductive element having cavities housing electrically connected embedded components (2024-01-30),
10. 11676910 - Embedded reference layers for semiconductor package substrates (2023-06-13),
11. 11574877 - Semiconductor miniaturization through component placement on stepped stiffener (2023-02-07),
12. 11562954 - Frame-array interconnects for integrated-circuit packages (2023-01-24),
13. 11527485 - Electrical shield for stacked heterogeneous device integration (2022-12-13),
14. 11527467 - Multi-chip package with extended frame (2022-12-13),
15. 11527463 - Hybrid ball grid array package for high speed interconnects (2022-12-13),

Title: Innovations of Jenny Shio Yin Ong: A Pioneering Inventor at Intel Corporation

Introduction: Jenny Shio Yin Ong is a remarkable inventor based in Bayan Lepas, Malaysia, with an impressive portfolio of 42 patents to her name. Her work in the field of technology has earned her significant recognition, particularly as she continues to push the boundaries of innovation at Intel Corporation.

Latest Patents: Among her latest contributions to the field are two notable patents. The first, titled "Hybrid boards with embedded planes," describes a hybrid dielectric interconnect stack for a printed circuit board. This innovative design features a structured layout comprising various dielectric layers with distinct dielectric constants and loss tangents, enhancing the performance of printed circuit boards.

The second patent, "Molded silicon interconnects in bridges for integrated-circuit packages," outlines advancements in silicon interconnect bridges integrated within a molded frame. This design incorporates passive devices and through-silicon vias that connect to a redistribution layer, optimizing the functionality of integrated-circuit packages.

Career Highlights: Jenny's career at Intel Corporation has been marked by her unwavering commitment to technological advancement. Her innovative designs and contributions have had a significant impact on the company's product development and research efforts. With a strong background in engineering and a deep understanding of materials science, she continues to be an invaluable asset to the organization.

Collaborations: Throughout her career at Intel Corporation, Jenny has collaborated with esteemed colleagues such as Seok Ling Lim and Jackson Chung Peng Kong. These partnerships have fostered a dynamic innovation environment, allowing for the exchange of ideas and enhancing the overall effectiveness of their work.

Conclusion: Jenny Shio Yin Ong stands out as a leading inventor in the technology sector, with her extensive patent portfolio showcasing her dedication to innovation. Her work at Intel Corporation and collaborations with talented coworkers have contributed to impactful advancements in the field of printed circuit board technology and integrated circuits. As she continues her innovative journey, the technological community eagerly anticipates further contributions that will shape the future of electronics.

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