The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Jul. 04, 2022
Intel Corporation, Santa Clara, CA (US);
Bok Eng Cheah, Gelugor, MY;
Seok Ling Lim, Kulim Kedah, MY;
Jenny Shio Yin Ong, Bayan Lepas, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Kooi Chi Ooi, Gelugor, MY;
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
A semiconductor package includes a package substrate, a base die including a first die surface coupled to the package substrate, and a second die surface opposite to the first die surface, and a first device including a first device surface coupled to the package substrate, and a second device surface opposite to the first device surface. The semiconductor package further includes a second device including a third device surface coupled to the second device surface, and a fourth device surface opposite to the third device surface, and a bridge including a first portion coupled to the package substrate, and a second portion coupled to the first portion, the fourth device surface and the second die surface.