Seok Ling Lim

This inventor holds 49 USPTO granted patents and 36 published patent applications, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2015-2026.

USPTO Granted Patents = 49 (Patent Applications = 36)

% Patents Active = 91.8

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 44(Granted Patents)

Location History:

Kedah, MY (2022)
Kulim, MY (2015 - 2024)
Kulim Kedah, MY (2022 - 2024)

Company Filing History:

49 out of 56,184

Intel Corporation

patents

Years Active: 2015-2026

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Areas of Expertise:

Semiconductor Packages

Interconnects

Multi-Chip Package

Embedded Components

Stacked Memory

Electrical Shield

Hybrid Boards

3D Packaging

Die-to-Die Interconnects

Laminated Circuit Boards

Molded Interconnects

Voltage Reference

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685171 - Semiconductor package with extended stiffener (2026-07-14),

2. 12653047 - Composite bridges for 3D stacked integrated circuit power delivery (2026-06-09),

3. 12635565 - Semiconductor packages for alternate stacked memory and methods of manufacturing the same (2026-05-19),

4. 12604747 - Opossum redistribution frame for configurable memory devices (2026-04-14),

5. 12599013 - Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same (2026-04-07),

6. 12588511 - Shielding assembly for semiconductor packages (2026-03-24),

7. 12500175 - Integrated bridge frame for package substrate (2025-12-16),

8. 12328816 - Asymmetrical laminated circuit boards for improved electrical performance (2025-06-10),

9. 12256487 - Hybrid boards with embedded planes (2025-03-18),

10. 12218064 - Molded silicon interconnects in bridges for integrated-circuit packages (2025-02-04),

11. 12191281 - Multi-chip package with recessed memory (2025-01-07),

12. 12183722 - Molded interconnects in bridges for integrated-circuit packages (2024-12-31),

13. 12142570 - Composite bridge die-to-die interconnects for integrated-circuit packages (2024-11-12),

14. 12002747 - Integrated bridge for die-to-die interconnects (2024-06-04),

15. 11955431 - Interposer structures and methods for 2.5D and 3D packaging (2024-04-09),

Title: The Innovative Journey of Seok Ling Lim

Introduction: Seok Ling Lim, a talented inventor hailing from Kulim, Malaysia, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Seok Ling Lim's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a unique wearable device that monitors health metrics in real-time.

Career Highlights: With a career spanning over two decades, Seok Ling Lim has worked tirelessly to bring his innovative concepts to life. His dedication to pushing the boundaries of technology has led to numerous successful inventions that have improved the lives of many.

Collaborations: Throughout his career, Seok Ling Lim has collaborated with leading tech companies and research institutions to further develop his inventions. His ability to work effectively in a team setting has resulted in the successful implementation of several groundbreaking projects.

Conclusion: Seok Ling Lim's passion for innovation and his relentless drive to create have solidified his position as a respected figure in the world of technology. His inventive spirit continues to inspire others to think outside the box and pursue their creative ideas.