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For the Inventor, By the Inventor

Glugor, Malaysia

Kooi Chi Ooi

USPTO Granted Patents = 59 

 

Average Co-Inventor Count = 4.4

ph-index = 8

Forward Citations = 555(Granted Patents)

Forward Citations (Not Self Cited) = 538(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Teluk Kumbar, MY (2010)
  • Penang, MY (2007 - 2014)
  • Georgetown, MY (2015)
  • Bayan Lepas, MY (2015 - 2017)
  • Gelugor, MY (2019)
  • Pinang, MY (2022)
  • Bukit Gambir, MY (2021 - 2023)
  • Gelugor Pulau Pinang, MY (2022 - 2023)
  • Glugor, MY (2017 - 2024)

Company Filing History:

goldMedal59 out of 54,780 
 
Intel Corporation
 patents

Years Active: 2007-2025

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Areas of Expertise:
Semiconductor Packaging
Hybrid Mold Layers
Integrated Circuit Interconnects
Machine Learning Models
Signal Integrity Protection
Wearable Electronic Devices
Flexible Packaging Architecture
High-Speed Interconnects
Multi-Chip Packages
Electrical Interconnects
3D Integrated Packaging
Ultra-Thin Package Structures
59 patents (USPTO):Explore Patents
1. 12512414 - Vertical interconnect design for improved electrical performance (2025-12-30),
2. 12500175 - Integrated bridge frame for package substrate (2025-12-16),
3. 12288740 - Semiconductor package with hybrid mold layers (2025-04-29),
4. 12218064 - Molded silicon interconnects in bridges for integrated-circuit packages (2025-02-04),
5. 12002747 - Integrated bridge for die-to-die interconnects (2024-06-04),
6. 11887917 - Encapsulated vertical interconnects for high-speed applications and methods of assembling same (2024-01-30),
7. 11837458 - Substrate with gradiated dielectric for reducing impedance mismatch (2023-12-05),
8. 11798894 - Devices and methods for signal integrity protection technique (2023-10-24),
9. 11710029 - Methods and apparatus to improve data training of a machine learning model using a field programmable gate array (2023-07-25),
10. 11676910 - Embedded reference layers for semiconductor package substrates (2023-06-13),
11. 11586473 - Methods and apparatus for allocating a workload to an accelerator using machine learning (2023-02-21),
12. 11584368 - Evaluating risk factors of proposed vehicle maneuvers using external and internal data (2023-02-21),
13. 11545434 - Vertical die-to-die interconnects bridge (2023-01-03),
14. 11527485 - Electrical shield for stacked heterogeneous device integration (2022-12-13),
15. 11527467 - Multi-chip package with extended frame (2022-12-13),

Title: The Visionary Innovations of Kooi Chi Ooi

Introduction:

Kooi Chi Ooi, a prolific inventor based in Glugor, MY, has made significant contributions to the field of technology with his passion for innovation and relentless pursuit of excellence.

Latest Patents:

Ooi's latest patents include "Encapsulated vertical interconnects for high-speed applications and methods of assembling same," which revolutionizes semiconductor package substrates. Another groundbreaking patent is "Substrate with gradiated dielectric for reducing impedance mismatch," enhancing electronic circuits' performance.

Career Highlights:

With an impressive portfolio of 54 patents, Kooi Chi Ooi has established himself as a trailblazer in the realm of technology. He is a key figure at Intel Corporation, where his innovative mindset continues to drive advancements in the industry.

Collaborations:

Ooi's collaborations with esteemed colleagues such as Bok Eng Cheah and Jackson Chung Peng Kong have led to the development of cutting-edge technologies that push the boundaries of what is possible in the tech landscape.

Conclusion:

In conclusion, Kooi Chi Ooi stands as a visionary inventor whose remarkable achievements not only inspire the next generation of inventors but also shape the future of technology. His dedication to innovation and creativity serves as a beacon for aspiring innovators worldwide.

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