The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Oct. 11, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Bok Eng Cheah, Bukit Gambir, MY;

Ping Ping Ooi, Butterworth, MY;

Kooi Chi Ooi, Glugor, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2223/6616 (2013.01); H05K 3/0094 (2013.01); H05K 3/426 (2013.01);
Abstract

An electronic circuit including a substrate having a first dielectric characteristic. The substrate can include a first side and a second side. An intermediary material can be disposed within the substrate. For instance, the intermediary material can be located between the first side and the second side. The intermediary material can include a second dielectric characteristic, where the second dielectric characteristic is different than the first dielectric characteristic. A first conductive layer can be disposed on the first side, and a second conductive layer can be disposed on the second side. A conductive path can be electrically coupled between the first conductive layer and the second conductive layer. The conductive path can be in contact with at least a portion of the intermediary material.


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