The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Aug. 07, 2020
Intel Corporation, Santa Clara, CA (US);
Jenny Shio Yin Ong, Bayan Lepas Pulau Pinang, MY;
Seok Ling Lim, Kulim Kedah, MY;
Bok Eng Cheah, Gelugor Pulau Pinang, MY;
Jackson Chung Peng Kong, Tanjung Tokong Pulau Pinang, MY;
Saravanan Sethuraman, Bayan Lepas Pulau Pinang, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
Semiconductor packages, and methods for making the semiconductor packages, having an interposer structure with one or more interposer and an extension platform, which has an opening for placing the interposer, and the space between the interposer and the extension platform is filled with a polymeric material to form a unitary interposer-extension platform composite structure. A stacked structure may be formed by at least a first semiconductor chip coupled to the interposer and at least a second semiconductor chip coupled to the extension platform, and at least one bridge extending over the space that electrically couples the extension platform and the interposer. The extension platform may include a recess step section that may accommodate a plurality of passive devices to reduced power delivery inductance loop for the high-density 2.5D and 3D stacked packaging applications.