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For the Inventor, By the Inventor

Watervliet, NY, United States of America

Andrew W Metz

This inventor holds 38 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Etching. Top assignees: Tokyo Electron Limited, Tokyo Electron Limi Ted. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andrew W Metz. Retrieved from https://idiyas.com/inventor/andrew-w-metz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 

% Patents Active = 86.8

Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 86(Granted Patents)


Location History:

  • Loundonville, NY (US) (2013 - 2014)
  • Watervliet, NY (US) (2016 - 2021)
  • Albany, NY (US) (2021 - 2024)

Company Filing History:

goldMedal37 out of 10,883 
 
Tokyo Electron Limited
 patents
silverMedal1 out of 103 
 
Tokyo Electron Limi Ted
 patents

Years Active: 2013-2026

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Areas of Expertise:
Plasma Etching
Carbon Mask
Critical Dimension Control
Self-Aligned Contacts
High Aspect Ratio
Etch Selectivity
EUV Resists
Silicon Nitride
Cyclic Plasma Processing
Spin-On Silicon Carbide
Metal Hard Mask
Reactive Ion Etching
38 patents (USPTO):Explore Patents
1. 12706287 - Plasma etching with metal sputtering (2026-08-11),
2. 12685055 - Semiconductor devices and methods of manufacturing the same (2026-07-14),
3. 12400872 - Sacrificial capping layer for gate protection (2025-08-26),
4. 12354842 - In-situ focus ring coating (2025-07-08),
5. 12341009 - Variable hardness amorphous carbon mask (2025-06-24),
6. 12334356 - Plasma etching tools and systems (2025-06-17),
7. 12288692 - Method of forming a FET structure by selective deposition of film on source/drain contact (2025-04-29),
8. 12266534 - Forming a semiconductor device using a protective layer (2025-04-01),
9. 12266533 - Sacrificial capping layer for contact etch (2025-04-01),
10. 12211911 - Recessed contact structures and methods (2025-01-28),
11. 12191202 - Contact openings in semiconductor devices (2025-01-07),
12. 12080599 - Methods for forming self-aligned contacts using spin-on silicon carbide (2024-09-03),
13. 12040176 - Technologies for high aspect ratio carbon etching with inserted charge dissipation layer (2024-07-16),
14. 11978631 - Forming contact holes with controlled local critical dimension uniformity (2024-05-07),
15. 11961735 - Cyclic plasma processing (2024-04-16),

Title: The Innovative Journey of Andrew W Metz

Introduction: Andrew W Metz, a talented inventor hailing from Watervliet, NY, has made significant contributions to the world of innovation with his creative mind and dedication to progress.

Latest Patents: Andrew W Metz holds several patents in various fields, showcasing his versatility and ingenuity in inventing new solutions to existing problems. His latest patents focus on cutting-edge technologies in the automotive industry, sustainable energy, and consumer electronics.

Career Highlights: Throughout his illustrious career, Andrew W Metz has been recognized for his groundbreaking inventions that have revolutionized different sectors. His commitment to pushing the boundaries of what is possible has led to numerous successful ventures and collaborations with industry leaders.

Collaborations: Andrew W Metz has collaborated with top research institutions, leading companies, and brilliant minds in the field of innovation. His ability to work effectively in teams and leverage collective expertise has resulted in the development of groundbreaking technologies that have had a lasting impact.

Conclusion: In conclusion, Andrew W Metz's passion for innovation, coupled with his relentless drive to create, has solidified his position as a prominent figure in the world of inventors. His contributions continue to inspire future generations of inventors to think outside the box and pursue their ideas fearlessly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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