Sinzing, Germany

Alfred Haimerl

This inventor holds 37 USPTO granted patents and 1 published patent application, primarily in Semiconductor Technology. Top assignees: Infineon Technologies Ag, Qimonda Ag. Active years: 2005-2019.

USPTO Granted Patents = 37 

% Patents Active = 27.0

Average Co-Inventor Count = 3.9

ph-index = 7

Forward Citations = 172(Granted Patents)


Company Filing History:


Years Active: 2005-2019

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Areas of Expertise:
Smart Card Module
Chip Packages
Circuit Board
Semiconductor Component
Power Semiconductor Device
Electronic Module
Flexible Bonding
Sensor Chip
Plastic Housing Composition
Thermoplastic Composite
Lead Structure
Carbon Nanotubes
37 patents (USPTO):Explore Patents

Title: The Innovative Mind of Alfred Haimerl

Introduction: Alfred Haimerl, a prolific inventor based in Sinzing, Germany, has made significant contributions to the field of technology throughout his career. With an impressive portfolio of 37 patents, Haimerl has positioned himself as a key player in the development of cutting-edge innovations, particularly in smart card technology.

Latest Patents: Among Haimerl's recent inventions are several noteworthy patents that showcase his expertise. His “Smart card module, smart card, and method for producing a smart card module” features a sophisticated design that includes a substrate with plated-through holes linking various components. The design incorporates a chip mounted on the substrate alongside a dual-metal structure that maintains electrical insulation between the components. Additionally, his patent related to “Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages” reflects innovative approaches in chip packaging that enhance electronic performance.

Career Highlights: Haimerl's career includes important roles at leading technology firms, such as Infineon Technologies AG and Qimonda AG. During his tenure at these companies, he focused on advancing semiconductor technologies and contributed significantly to the development of electronic components.

Collaborations: Throughout his career, Haimerl has had the opportunity to work alongside talented professionals such as Michael Bauer and Joachim Mahler. Their collaborations have undoubtedly enriched his innovative projects and resulted in advancements in the technologies they developed together.

Conclusion: Alfred Haimerl's impressive array of patents and his collaborative efforts highlight his significant impact on the field of technology. His work, particularly in smart card systems and chip technologies, underscores the importance of innovation in fostering advancements that shape the future of electronics. As technology continues to evolve, inventors like Haimerl remain at the forefront, pushing the boundaries of what is possible.

Profile summary based on public USPTO records.
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