The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Dec. 15, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Michael Bauer, Nittendorf, DE;

Alfred Haimerl, Sinzing, DE;

Angela Kessler, Sinzing, DE;

Wolfgang Schober, Amberg, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49805 (2013.01); H01L 21/56 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); H01L 23/3157 (2013.01); H01L 23/3171 (2013.01); H01L 23/492 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/20 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 23/3121 (2013.01); H01L 23/49562 (2013.01); H01L 24/13 (2013.01); H01L 24/19 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/19 (2013.01); H01L 2224/20 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed over and at least partially surrounding the chip; one or more electrically conductive contact regions formed over the electrically insulating material and in electrical connection with the chip; a further electrically insulating material disposed over a chip carrier bottom side; wherein an electrically conductive contact region on the chip carrier bottom side is released from the further electrically insulating material.


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