The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Mar. 28, 2007
Michael Bauer, Nittendorf, DE;
Alfred Haimerl, Sinzing, DE;
Angela Kessler, Regensburg, DE;
Joachim Mahler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Michael Bauer, Nittendorf, DE;
Alfred Haimerl, Sinzing, DE;
Angela Kessler, Regensburg, DE;
Joachim Mahler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Infineon Technologies AG, , DE;
Abstract
A semiconductor chip () has a metal coating structure () which has on an active upper side () of the semiconductor chip () at least one lower metal layer () with copper or copper alloy, on which a central metal layer () with nickel is arranged. The metal coating structure () is terminated by an upper metal layer () of palladium and/or a precious metal. The central metal layer () with nickel and/or nickel phosphide has a rough interface () with respect to the plastic package molding compound surrounding the metal coating structure ().