The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Dec. 19, 2006
Michael Bauer, Nittendorf, DE;
Angela Kessler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Alfred Haimerl, Sinzing, DE;
Joachim Mahler, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Angela Kessler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Alfred Haimerl, Sinzing, DE;
Joachim Mahler, Regensburg, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.