The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2013

Filed:

Feb. 09, 2005
Applicants:

Michael Bauer, Nittendorf, DE;

Thomas Engling, Koenigsbronn, DE;

Alfred Haimerl, Sinzing, DE;

Angela Kessler, Regensburg, DE;

Joachim Mahler, Regensburg, DE;

Wolfgang Schober, Amberg, DE;

Inventors:

Michael Bauer, Nittendorf, DE;

Thomas Engling, Koenigsbronn, DE;

Alfred Haimerl, Sinzing, DE;

Angela Kessler, Regensburg, DE;

Joachim Mahler, Regensburg, DE;

Wolfgang Schober, Amberg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.


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