The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Mar. 06, 2012
Joachim Mahler, Regensburg, DE;
Alfred Haimerl, Sinzing, DE;
Angela Kessler, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Joachim Mahler, Regensburg, DE;
Alfred Haimerl, Sinzing, DE;
Angela Kessler, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A chip arrangement includes semiconductor chips coupled to opposing sides of an insulating layer. The arrangement includes a first semiconductor chip having a first chip surface presenting a first chip conductive region. An electrically insulating layer includes a first layer surface presenting a first layer conductive region, and a second, opposing surface presenting a second layer conductive region. The electrically insulating layer is coupled to the first semiconductor chip by applying the first layer conductive region to the first chip conductive region. The electrically insulating layer is then coupled to the second chip conductive region by applying the second layer conductive region to the second chip conductive region.