The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Mar. 28, 2007
Michael Bauer, Nittendorf, DE;
Alfred Haimerl, Sinzing, DE;
Khalil Hosseini, Weihmichl, DE;
Angela Kessler, Regensburg, DE;
Joachim Mahler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Michael Bauer, Nittendorf, DE;
Alfred Haimerl, Sinzing, DE;
Khalil Hosseini, Weihmichl, DE;
Angela Kessler, Regensburg, DE;
Joachim Mahler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.