The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8507080 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 13, 2013

Filed:

Apr. 26, 2006
Applicants:

Joachim Mahler, Regensburg, DE;

Alfred Haimerl, Sinzing, DE;

Wolfgang Schober, Amberg, DE;

Michael Bauer, Nittendorf, DE;

Angela Kessler, Regensburg, DE;

Inventors:

Joachim Mahler, Regensburg, DE;

Alfred Haimerl, Sinzing, DE;

Wolfgang Schober, Amberg, DE;

Michael Bauer, Nittendorf, DE;

Angela Kessler, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B 5/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.


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Mahler, Joachim. (2013). Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material (U.S. Patent No. 8507080). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8507080

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