The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Feb. 20, 2006
Applicants:
Joachim Mahler, Regensburg, DE;
Alfred Haimerl, Sinzing, DE;
Michael Bauer, Nittendorf, DE;
Angela Kessler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Inventors:
Joachim Mahler, Regensburg, DE;
Alfred Haimerl, Sinzing, DE;
Michael Bauer, Nittendorf, DE;
Angela Kessler, Regensburg, DE;
Wolfgang Schober, Amberg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.