For the Inventor, By the Inventor

Enter assignee name

Durham, NC, United States of America

Wolfspeed, Inc.

USPTO Granted Patents = 212

CIPO Patents = 2

EPO Patents = 35

Trademarks = 54

Forward Citations = 163

Loading Chart...

Loading Chart...

199 inventors (with patents filed for the assignee):

Daniel Jenner Lichtenwalner (34 out of 52 patents)

Sei-Hyung Ryu (28 out of 107 patents)

Brice McPherson (28 out of 51 patents)

4. Edward Robert Van Brunt (23 out of 45 patents)

5. Scott Thomas Sheppard (23 out of 100 patents)

6. Alexander Komposch (18 out of 38 patents)

7. Daniel John Martin (15 out of 18 patents)

8. Woongsun Kim (14 out of 14 patents)

9. Qianli Mu (14 out of 27 patents)

10. Fabian Radulescu (13 out of 37 patents)

11. Naeem Islam (13 out of 13 patents)

12. Saptharishi Sriram (13 out of 47 patents)

13. Marvin Marbell (11 out of 28 patents)

14. Jia Guo (11 out of 17 patents)

15. Kyle Bothe (11 out of 20 patents)

Core Competencies:

High-Electron Mobility Transistors

Silicon Carbide Wafers

Electrical Discharge Machining

Semiconductor Device Packages

Hybrid Seed Structure

Vertical Power Devices

Laser-Based Surface Processing

Power Modules

Trenched Gate Structures

Wide Bandgap Transistors

Nondestructive Characterization

Radio Frequency Amplifiers

212 patents: Sort by Forward Citations

1. 12512658 - Device having a rate of current change limiter and process of implementing the same (2025-12-30),

2. 12500585 - Optimization of power module performance via parasitic mutual coupling (2025-12-16),

3. 12484244 - Group III-nitride high-electron mobility transistors with gate connected buried p-type layers and process for making the same (2025-11-25),

4. 12477770 - Group III-nitride high-electron mobility transistors with buried p-type layers and process for making the same (2025-11-18),

5. 12473661 - Large diameter silicon carbide wafers (2025-11-18),

6. 12470185 - Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same (2025-11-11),

7. 12469682 - Electrical discharge machining processing for semiconductor workpiece (2025-11-11),

8. 12454768 - Hybrid seed structure for crystal growth system (2025-10-28),

9. 12446300 - Semiconductor devices having on-chip gate resistors (2025-10-14),

10. 12446180 - High power multilayer module having low inductance and fast switching for paralleling power devices (2025-10-14),

11. 12439664 - Methods of forming ohmic contacts on semiconductor devices with trench/mesa structures (2025-10-07),

12. 12438103 - Transistor including a discontinuous barrier layer (2025-10-07),

13. 12438097 - Integrated power module (2025-10-07),

14. 12438001 - Off axis laser-based surface processing operations for semiconductor wafers (2025-10-07),

15. 12434330 - Laser-based surface processing for semiconductor workpiece (2025-10-07),

Wolfspeed, Inc. is a leading provider of silicon carbide (SiC) based power and wireless technology. With a focus on producing high-performance semiconductors, Wolfspeed enables efficient power conversion, advanced wireless infrastructure, and cutting-edge electric vehicle (EV) charging solutions. Headquartered in North Carolina, USA, Wolfspeed serves diverse industries including automotive, telecommunications, energy, and industrial sectors. With its innovative solutions, Wolfspeed strives to shape the future of power and wireless technology.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

212 Patents

#5 in Durham, NC

#49 in North Carolina

#1,891 in US

#3,894 in the World

Durham, NC, United States of America

Wolfspeed, Inc.

Forward Citations = 163

199 inventors:

Daniel Jenner Lichtenwalner (34 out of 52 patents)

Sei-Hyung Ryu (28 out of 107 patents)

Brice McPherson (28 out of 51 patents)

4. Edward Robert Van Brunt (23 out of 45 patents)

5. Scott Thomas Sheppard (23 out of 100 patents)

Please report any incorrect information to support@idiyas.com

Loading…