The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Oct. 06, 2023
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Woongsun Kim, Cary, NC (US);

Naeem Islam, Morrisville, NC (US);

Madankumar Sampath, Morrisville, NC (US);

Sei-Hyung Ryu, Cary, NC (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H10D 12/01 (2025.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01); H10D 62/17 (2025.01); H10D 62/832 (2025.01); H10D 64/23 (2025.01); H10P 30/22 (2026.01);
U.S. Cl.
CPC ...
H10D 62/109 (2025.01); H10D 12/031 (2025.01); H10D 30/668 (2025.01); H10D 62/393 (2025.01); H10D 62/8325 (2025.01); H10D 64/252 (2025.01); H10P 30/22 (2026.01);
Abstract

A semiconductor device comprises a silicon carbide based semiconductor layer structure that includes a drift layer having a first conductivity type, a gate trench that extends to a first depth into an upper surface of the semiconductor layer structure, a gate electrode in the gate trench, a support shield trench that extends to a second depth into the upper surface of the semiconductor layer structure, where the second depth is less than the first depth, and a source metallization layer on the upper surface of the semiconductor layer structure and extending into the support shield trench.


Find Patent Forward Citations

Loading…