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United Semiconductor (Xiamen) Co., Ltd.

USPTO Granted Patents = 49

Forward Citations = 16

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80 inventors (with patents filed for the assignee):

Wen Yi Tan (47 out of 47 patents)

Chin-Chun Huang (13 out of 13 patents)

Shih-Hsien Huang (10 out of 28 patents)

4. Sheng-Hsu Liu (7 out of 14 patents)

5. Jinjian Ouyang (6 out of 6 patents)

6. Yuan-Chi Pai (6 out of 6 patents)

7. Hailong Gu (5 out of 5 patents)

8. Guang Yang (4 out of 4 patents)

9. Linshan Yuan (4 out of 4 patents)

10. You-Di Jhang (4 out of 7 patents)

11. Chih-Chien Huang (3 out of 3 patents)

12. Ji He Huang (3 out of 3 patents)

13. Bin Guo (3 out of 4 patents)

14. Yun-Pin Teng (3 out of 3 patents)

15. Maohua Ren (3 out of 3 patents)

Core Competencies:

Semiconductor Manufacturing

Epitaxial Layer Formation

Wafer Polishing

Resistive Memory Device

Lithography Techniques

Thermal Processing

Transistor Structure

Integrated Circuits

CMP Polishing System

Radiofrequency Devices

Electro-Chemical Plating

Testkey Structures

49 patents: Sort by Forward Citations

1. 12443178 - Machine monitoring system and machine monitoring method (2025-10-14),

2. 12432997 - Method for forming an epitaxial layer with better quality (2025-09-30),

3. 12427548 - Cleaning process of wafer polishing pad and cleaning nozzle (2025-09-30),

4. 12416866 - Overlay mark (2025-09-16),

5. 12394673 - Semiconductor manufacturing process (2025-08-19),

6. 12356677 - Semiconductor device and method for fabricating the same (2025-07-08),

7. 12276020 - Semiconductor cleaning step (2025-04-14),

8. 12219886 - Resistive memory device (2025-02-04),

9. 12216072 - Reticle thermal expansion calibration method capable of improving sub-recipe (2025-02-04),

10. 12213391 - Resistive random access memory and method of forming the same (2025-01-28),

11. 12204247 - Lithography film stack and lithography method (2025-01-21),

12. 12191377 - Method for forming a semiconductor structure (2025-01-07),

13. 12191211 - Method for making semiconductor device using a stress memorization technique (2025-01-07),

14. 12191171 - Apparatus for thermally processing a substrate (2025-01-07),

15. 12094820 - Semiconductor device having inter-metal dielectric patterns and method for fabricating the same (2024-09-17),

United Semiconductor (Xiamen) Co., Ltd. is a leading integrated circuit (IC) design company based in Xiamen, China. Since its establishment in 1997, United Semiconductor has been committed to providing innovative IC solutions and excellent customer service. With a focus on research and development, manufacturing, and sales of semiconductor products, United Semiconductor offers a wide range of IC products for various industries, including automotive, telecommunications, consumer electronics, and industrial applications. United Semiconductor's dedication to technology innovation and quality has earned them a reputation as a trusted partner in the global semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

49 Patents

#9 in Fujian

#590 in China

#13,878 in the World

United Semiconductor (Xiamen) Co., Ltd.

Forward Citations = 16

80 inventors:

Wen Yi Tan (47 out of 47 patents)

Chin-Chun Huang (13 out of 13 patents)

Shih-Hsien Huang (10 out of 28 patents)

4. Sheng-Hsu Liu (7 out of 14 patents)

5. Jinjian Ouyang (6 out of 6 patents)

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