For the Inventor, By the Inventor

Enter assignee name

Jarfalla, Sweden

Silex Microsystems Ab

USPTO Granted Patents = 29

CIPO Patents = 5

EPO Patents = 20

Trademarks = 8

Forward Citations = 123

Loading Chart...

Loading Chart...

32 inventors (with patents filed for the assignee):

Thorbjörn Ebefors (22 out of 24 patents)

Edvard Kälvesten (15 out of 19 patents)

Niklas Svedin (10 out of 11 patents)

4. Tomas Bauer (5 out of 5 patents)

5. Peter Agren (4 out of 4 patents)

6. Daniel Perttu (4 out of 4 patents)

7. Anders Eriksson (4 out of 4 patents)

8. Pelle Rangsten (2 out of 11 patents)

9. Henrik Knutsson (2 out of 2 patents)

10. Ulf Erlesand (2 out of 2 patents)

11. Edward Kalvesten (2 out of 2 patents)

12. Marianne Mechbach (2 out of 2 patents)

13. Göran Stemme (1 out of 27 patents)

14. Thierry Corman (1 out of 3 patents)

15. Edward Kälvesten (1 out of 1 patent)

29 patents: Sort by Forward Citations

1. 9936918 - Insulation of micro structures (2018-04-10),

2. 9718674 - Thin capping for MEMS devices (2017-08-01),

3. 9620390 - Method of making a semiconductor device having a functional capping (2017-04-11),

4. 9613863 - Method for forming electroless metal through via (2017-04-04),

5. 9607915 - Through substrate vias and device (2017-03-28),

6. 9514985 - Electroless metal through silicon via (2016-12-06),

7. 9511999 - Thin film capping (2016-12-06),

8. 9507142 - Precise definition of transducer electrodes (2016-11-29),

9. 9484293 - Semiconductor devices with close-packed via structures having in-plane routing and method of making same (2016-11-01),

10. 9448401 - Via structure and method thereof (2016-09-20),

11. 9362139 - Method of making a semiconductor device having a functional capping (2016-06-07),

12. 9355895 - Method of providing a via hole and routing structure (2016-05-31),

13. 9312217 - Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections (2016-04-12),

14. 9249009 - Starting substrate for semiconductor engineering having substrate-through connections and a method for making same (2016-02-02),

15. 9240373 - Semiconductor devices with close-packed via structures having in-plane routing and method of making same (2016-01-19),

Silex Microsystems AB is a leading provider of MEMS (Micro-Electro-Mechanical Systems) solutions. With over 20 years of experience, Silex offers cutting-edge technology, outstanding quality, and cost-effective solutions for the global MEMS market. The company specializes in developing and manufacturing customizable MEMS components for various applications, including optical switches, accelerometers, microphones, pressure sensors, and more. Silex Microsystems serves diverse industries such as telecommunications, automotive, consumer electronics, and medical devices.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

29 Patents

#1 in Jarfalla

#216 in Sweden

#21,835 in the World

Jarfalla, Sweden

Silex Microsystems Ab

Forward Citations = 123

32 inventors:

Thorbjörn Ebefors (22 out of 24 patents)

Edvard Kälvesten (15 out of 19 patents)

Niklas Svedin (10 out of 11 patents)

4. Tomas Bauer (5 out of 5 patents)

5. Peter Agren (4 out of 4 patents)

Please report any incorrect information to support@idiyas.com

Loading…