Henrik Knutsson

Title: Innovator Spotlight: Henrik Knutsson

Introduction

Henrik Knutsson, an inventive engineer based in Vastervik, Sweden, has made significant strides in the semiconductor industry. With two notable patents to his name, his work focuses on advanced methods to enhance the manufacturing of semiconductor substrates.

Latest Patents

Knutsson's latest patents are centered around methods for forming electroless metal through vias, specifically in semiconductor substrates. One such method involves creating a substrate-through metal via that exhibits a high aspect ratio. This innovative process includes providing a semiconductor substrate, where poly-silicon is deposited and subsequently patterned by etching away unwanted portions.

In this process, Nickel (Ni) is selectively deposited onto the poly-silicon using an electroless method. A via hole is then created through the substrate, with the walls undergoing similar processing. Finally, Copper (Cu) is deposited on the Ni via a plating technique, allowing for line widths and spacings of less than 10 micrometers on both sides of the wafer.

Career Highlights

Henrik Knutsson is currently associated with Silex Microsystems AB, a company that specializes in microfabrication for MEMS and semiconductor applications. His contributions have been essential in streamlining processes that optimize the performance of semiconductor components.

Collaborations

Knutsson often collaborates with Thorbjorn Ebefors, his coworker at Silex Microsystems AB. Together, they leverage their expertise to further enhance the company's innovative solutions in the semiconductor field.

Conclusion

With his groundbreaking patents and collaborative spirit, Henrik Knutsson continues to impact the semiconductor industry significantly. As technology evolves, his contributions stand as benchmarks for advancements in manufacturing processes, ushering in a new era of innovation in semiconductors.