The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Aug. 26, 2014
Applicant:

Silex Microsystems Ab, Jarfalla, SE;

Inventors:

Edvard Kalvesten, Hagersten, SE;

Thorbjorn Ebefors, Huddinge, SE;

Niklas Svedin, Stockholm, SE;

Assignee:

SILEX MICROSYSTEMS AB, Jarfalla, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/08 (2006.01); B81B 7/00 (2006.01); H01L 21/50 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81C 1/00301 (2013.01); H01L 21/50 (2013.01); H01L 23/08 (2013.01); B81B 2201/01 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/095 (2013.01); B81C 2201/0153 (2013.01); B81C 2201/036 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0145 (2013.01); H01L 24/94 (2013.01); H01L 2924/16235 (2013.01);
Abstract

A device includes a base substrate () with a micro component () attached thereto. Suitably it is provided with routing elements () for conducting signals to and from the component (). It also includes spacer members () which also can act as conducting structures for routing signals vertically. There is a capping structure () of a glass material, provided above the base substrate (), bonded via the spacer members (), preferably by eutectic bonding, wherein the capping structure () includes vias () including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.


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