The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Apr. 19, 2012
Applicant:

Ulf Erlesand, Osterskar, SE;

Inventor:

Ulf Erlesand, Osterskar, SE;

Assignee:

SILEX MICROSYSTEMS AB, Jarfalla, SE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/04 (2006.01); B81B 3/00 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0086 (2013.01); B81C 1/00222 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 29/4236 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A substrate-through electrical connection () for connecting components on opposite sides of a substrate, and a method for making same. The connection includes a substrate-through via made from substrate material ('). There is a trench () provided surrounding the via, the walls of the trench being coated with a layer of insulating material () and the trench () is filled with conductive or semi-conductive material (). A doping region () for threshold voltage adjustment is provided in the via material in the surface of the inner trench wall between insulating material () and the material (′) in the via. There are contacts (″) to the via on opposite sides of the substrate, and a contact () to the conductive material () in the trench () so as to enable the application of a voltage to the conductive material ().


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