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Semiconductor Manufacturing International (Beijing) Corporation

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USPTO Granted Patents = 950

% Expired Patents = 0.42

Forward Citations = 807

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705 inventors (with patents filed for the assignee):

Fei Zhou (130 out of 153 patents)

Jun Yang (80 out of 129 patents)

Nan Wang (40 out of 72 patents)

4. Haiyang Zhang (38 out of 86 patents)

5. Jisong Jin (31 out of 39 patents)

6. Ming Zhou (24 out of 113 patents)

7. Hai Yang Zhang (18 out of 18 patents)

8. Mieno Fumitake (16 out of 40 patents)

9. Bo Su (15 out of 18 patents)

10. Zhongshan Hong (15 out of 57 patents)

11. Yan Wang (15 out of 129 patents)

12. Qiang Wu (14 out of 212 patents)

13. Fumitake Mieno (14 out of 33 patents)

14. Meng Zhao (13 out of 25 patents)

15. Cheng Zhang (10 out of 62 patents)

Core Competencies:

Semiconductor Structure

Fabrication Method

Device

FinFET

Memory Structure

Mask Pattern

Overlay Precision

Wet Etching

Interconnection

Graphene

Capacitor Structure

Static Random-Access Memory

950 patents: Sort by Forward Citations

1. 12765117 - Image sensor and fabrication method thereof (2026-10-13),

2. 12765028 - Semiconductor structure and forming method therefor (2026-10-13),

3. 12751030 - Semiconductor structure and forming method thereof (2026-09-29),

4. 12740091 - Semiconductor structure and forming method thereof (2026-09-15),

5. 12727138 - Semiconductor structure and forming method thereof (2026-09-01),

6. 12721118 - Semiconductor structure and method for forming same (2026-08-25),

7. 12699333 - Mask plate, alignment mark and photolithography system (2026-08-04),

8. 12696779 - Packaging structure and packaging method (2026-07-28),

9. 12685178 - Semiconductor structure comprising sub-alignment marks (2026-07-14),

10. 12684855 - Semiconductor structure comprising air spacer on sidewalls of gate electrode layer and fabrication method thereof (2026-07-14),

11. 12684820 - Semiconductor structure and fabrication method thereof (2026-07-14),

12. 12677430 - Semiconductor structure and forming method thereof (2026-07-07),

13. 12666644 - Semiconductor structure facilitating prevention of a parasitic device and method for forming same (2026-06-23),

14. 12615874 - Method for forming semiconductor structure (2026-04-28),

15. 12588477 - Method of etching a semiconductor device by etching initial mask structures at a region having an extension direction different from the extension direction of the initial mask structures (2026-03-24),

Company Overview

Semiconductor Manufacturing International (Beijing) Corporation is a leading player in the semiconductor industry, specializing in the development and manufacturing of advanced semiconductor structures. The company focuses on key technology areas such as FinFET devices, memory structures, and precise fabrication methods. With a commitment to innovation, SMIC enhances overlay precision and wet etching techniques, positioning itself as a vital contributor to the global semiconductor supply chain, particularly within the Chinese market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

950 Patents

#11 in Beijing

#34 in China

#1,076 in the World

Semiconductor Manufacturing International (Beijing) Corporation

Forward Citations = 807

705 inventors:

Fei Zhou (130 out of 153 patents)

Jun Yang (80 out of 129 patents)

Nan Wang (40 out of 72 patents)

4. Haiyang Zhang (38 out of 86 patents)

5. Jisong Jin (31 out of 39 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Semiconductor Manufacturing International (Beijing) Corporation. Retrieved from https://idiyas.com/company/semiconductor-manufacturing-international-beijing

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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