The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Oct. 26, 2022
Applicants:

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Xinxing Bai, Shanghai, CN;

Yaping Wang, Shanghai, CN;

Chunchao Fei, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 46/00 (2026.01); H10D 84/03 (2025.01); H10P 74/00 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 76/60 (2026.01);
U.S. Cl.
CPC ...
H10W 46/00 (2026.01); H10D 84/038 (2025.01); H10P 74/273 (2026.01); H10W 74/014 (2026.01); H10W 74/137 (2026.01); H10W 76/60 (2026.01); H10W 46/301 (2026.01); H10W 46/501 (2026.01);
Abstract

A semiconductor structure and a fabrication method of the semiconductor structure are provided. The semiconductor structure includes a substrate, and the substrate includes a scribe line region. The semiconductor structure also includes a device layer over the substrate. The device layer includes multiple devices, an interconnection structure electrically connected to the devices, and a dielectric layer surrounding the devices and the interconnection structure. Further, the device layer includes a passivation layer over the device layer, and an alignment mark in the passivation layer over the scribe line region. The alignment mark includes two or more sub-alignment marks, the two or more sub-alignment marks are arranged along an extension direction of the scribe line region, and adjacent sub-alignment marks of the two or more sub-alignment marks are spaced apart from each other.


Find Patent Forward Citations

Bai, Xinxing. (2026). Semiconductor structure comprising sub-alignment marks (U.S. Patent No. 12685178). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12685178

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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