Company Filing History:
Years Active: 2020
Title: Chunchao Fei: Innovator in Semiconductor Technologies
Introduction
Chunchao Fei is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technologies, particularly through his innovative patent related to wafer dicing methods. His work has implications for improving the efficiency and effectiveness of semiconductor manufacturing processes.
Latest Patents
Chunchao Fei holds a patent for a wafer dicing method. This disclosure provides wafer dicing methods and relates to the field of semiconductor technologies. Implementations of the dicing method may include performing laser stealth dicing processing on a wafer from the back surface of the wafer. After performing the laser stealth dicing processing, grinding and thinning processing is conducted on the back surface of the wafer. Following this, a dicing tape is stuck on the back surface of the wafer, and separation processing is performed on the wafer after sticking the dicing tape. In some implementations, stealth dicing is performed before grinding, allowing a laser to be directly imposed on the back surface of a wafer. This approach alleviates a laser attenuation problem and lowers the requirements on light transmittance of a dicing tape.
Career Highlights
Chunchao Fei has worked with notable companies in the semiconductor industry, including Semiconductor Manufacturing International Corporation in Beijing and Semiconductor Manufacturing International Corporation in Shanghai. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technologies.
Collaborations
Chunchao Fei has collaborated with several professionals in his field, including Lihui Lu and Po Yuan Chiang. These collaborations have likely enriched his work and contributed to the development of innovative solutions in semiconductor manufacturing.
Conclusion
Chunchao Fei is a key figure in the semiconductor industry, with a focus on wafer dicing methods that enhance manufacturing processes. His contributions and collaborations continue to influence advancements in semiconductor technologies.