The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Jan. 05, 2024
Applicants:

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Dayong Yan, Beijing, CN;

Changcheng Gao, Beijing, CN;

Qiang Shi, Beijing, CN;

Wei Zhang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0236 (2006.01); H01L 31/0288 (2006.01); H01L 31/18 (2006.01); H10F 71/00 (2025.01); H10F 77/1223 (2025.01); H10F 77/70 (2025.01);
U.S. Cl.
CPC ...
H10F 77/707 (2025.01); H10F 71/121 (2025.01); H10F 71/128 (2025.01); H10F 77/1223 (2025.01);
Abstract

An image sensor includes a first substrate and a photoelectric structure in the first substrate. The first substrate includes opposite first surface and second surfaces. The conductivity type of the photoelectric structure is opposite to that of the first substrate. The photoelectric structure includes a second doped region and multiple first doped regions. Each of the first doped regions is connected to the second doped region. The distance from the second doped region to the first surface is smaller than the distance from the first doped region to the first surface. The size of the first doped region in a direction parallel to the first surface is smaller than or equal to the size of the second doped region in the direction. The quantum efficiency (QE), detection band, and photo-sensing capability are improved.


Find Patent Forward Citations

Yan, Dayong. (2026). Image sensor and fabrication method thereof (U.S. Patent No. 12765117). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765117

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