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Newark, DE, United States of America

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

USPTO Granted Patents = 309

EPO Patents = 19

Trademarks = 8

Forward Citations = 2,037

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248 inventors (with patents filed for the assignee):

Bainian Qian (38 out of 39 patents)

Yi Guo (36 out of 141 patents)

Gregory P Muldowney (30 out of 48 patents)

4. Marty W DeGroot (27 out of 29 patents)

5. George C Jacob (27 out of 35 patents)

6. David B James (26 out of 65 patents)

7. Jeffrey James Hendron (21 out of 22 patents)

8. Zhendong Liu (21 out of 21 patents)

9. Kancharla-Arun Kumar Reddy (19 out of 19 patents)

10. Andrew Wank (18 out of 18 patents)

11. Hongyu Wang (17 out of 17 patents)

12. Matthew R Gadinski (15 out of 15 patents)

13. Teresa Brugarolas Brufau (15 out of 15 patents)

14. Mary Jo Kulp (15 out of 16 patents)

15. Joseph K So (15 out of 19 patents)

Core Competencies:

Chemical Mechanical Polishing

Polishing Pad

Fluorinated Polymer

Composite Silica Particles

High Porosity CMP

Defect Reduction

Polishing Composition

Multi-Lobed Features

Poromeric Polishing Pad

Tungsten Polishing

Silicon Nitride Polishing

Aqueous Compositions

309 patents: Sort by Forward Citations

1. 12491604 - Chemical mechanical polishing pad (2025-12-09),

2. 12447582 - Chemical mechanical polishing pad with fluorinated polymer and multimodal groove pattern (2025-10-21),

3. 12447581 - Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features (2025-10-21),

4. 12384002 - Composite pad for chemical mechanical polishing (2025-08-12),

5. 12330261 - Offset pore poromeric polishing pad (2025-06-17),

6. 12275116 - CMP polishing pad with window having transparency at low wavelengths and material useful in such window (2025-04-14),

7. 12220784 - Chemical mechanical polishing pad and preparation thereof (2025-02-11),

8. 12138737 - CMP polishing pad with enhanced rate (2024-11-12),

9. 12064846 - Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith (2024-08-20),

10. 12064845 - Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith (2024-08-20),

11. 12024652 - Polishing composition and method of polishing a substrate having enhanced defect reduction (2024-07-02),

12. 11897082 - Heterogeneous fluoropolymer mixture polishing pad (2024-02-13),

13. 11833638 - CMP polishing pad with polishing elements on supports (2023-12-05),

14. 11813713 - Chemical mechanical polishing pad and polishing method (2023-11-14),

15. 11806830 - Formulations for chemical mechanical polishing pads and CMP pads made therewith (2023-11-07),

Rohm and Haas Electronic Materials CMP Holdings, Inc. is a leading global provider of materials, technologies, and solutions for the semiconductor industry. With a focus on chemical mechanical planarization (CMP) technology, they offer a wide range of products used in the fabrication of integrated circuits (ICs) and other electronic devices. Their innovative solutions enable improved efficiency, performance, and reliability in semiconductor manufacturing processes. For more information, visit their website.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

309 Patents

#7 in Newark, DE

#37 in Delaware

#1,366 in US

#2,812 in the World

Newark, DE, United States of America

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Forward Citations = 2,037

248 inventors:

Bainian Qian (38 out of 39 patents)

Yi Guo (36 out of 141 patents)

Gregory P Muldowney (30 out of 48 patents)

4. Marty W DeGroot (27 out of 29 patents)

5. George C Jacob (27 out of 35 patents)

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