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For the Inventor, By the Inventor

Elkton, MD, United States of America

Jeffrey James Hendron

This inventor holds 22 USPTO granted patents and 6 published patent applications, primarily in Chemical Mechanical Polishing. Top assignees: Rohm and Haas Electronic Materials Cmp Holdings, Inc., Dow Global Technolgoies LLC, Rodel Holdings, Inc.. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jeffrey James Hendron. Retrieved from https://idiyas.com/inventor/jeffrey-james-hendron

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 95.5

Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 89(Granted Patents)


Company Filing History:

goldMedal21 out of 311 
 
Rohm and Haas Electronic Materials Cmp Holdings, Inc.
 patents
silverMedal9 out of 4,810 
 
Dow Global Technolgoies LLC
 patents
bronzeMedal1 out of 93 
 
Rodel Holdings, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2003-2020

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Areas of Expertise:
CMP Polishing Pad
Polishing Method
Composite Layer
Groove Pattern
Endpoint Detection
Slurry Reflux
Surface Shaping
Conditionable Pad
Polishing Medium
Multilayer Stack
Debris Removal
High-Rate CMP
22 patents (USPTO):Explore Patents
1. 10875146 - Debris-removal groove for CMP polishing pad (2020-12-29),
2. 10861702 - Controlled residence CMP polishing method (2020-12-08),
3. 10857648 - Trapezoidal CMP groove pattern (2020-12-08),
4. 10857647 - High-rate CMP polishing method (2020-12-08),
5. 10777418 - Biased pulse CMP groove pattern (2020-09-15),
6. 10586708 - Uniform CMP polishing method (2020-03-10),
7. 10569383 - Flanged optical endpoint detection windows and CMP polishing pads containing them (2020-02-25),
8. 10092998 - Method of making composite polishing layer for chemical mechanical polishing pad (2018-10-09),
9. 10011002 - Method of making composite polishing layer for chemical mechanical polishing pad (2018-07-03),
10. 9802293 - Method to shape the surface of chemical mechanical polishing pads (2017-10-31),
11. 9630293 - Chemical mechanical polishing pad composite polishing layer formulation (2017-04-25),
12. 9259820 - Chemical mechanical polishing pad with polishing layer and window (2016-02-16),
13. 9238296 - Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer (2016-01-19),
14. 9238295 - Soft and conditionable chemical mechanical window polishing pad (2016-01-19),
15. 9233451 - Soft and conditionable chemical mechanical polishing pad stack (2016-01-12),

Title: Jeffrey James Hendron - Innovative Inventor from Elkton, MD

Introduction: Jeffrey James Hendron is a talented inventor hailing from Elkton, Maryland. With a passion for creating groundbreaking solutions, he has made significant contributions to the field of innovation.

Latest Patents: Jeffrey James Hendron holds several patents in various industries, showcasing his diverse range of expertise and creativity. His latest patents focus on cutting-edge technologies that aim to improve efficiency and enhance user experience.

Career Highlights: Throughout his career, Jeffrey James Hendron has demonstrated a keen ability to identify gaps in the market and develop unique inventions to address them. His innovative mindset has led to the successful commercialization of several products, making a lasting impact on the industry.

Collaborations: Jeffrey James Hendron has collaborated with leading companies and research institutions to bring his inventions to life. His partnerships have been instrumental in refining his ideas and ensuring that they meet the highest standards of quality and innovation.

Conclusion: Jeffrey James Hendron's relentless pursuit of innovation and his dedication to pushing the boundaries of what is possible make him a standout inventor in the field. His contributions continue to inspire others to think outside the box and strive for excellence in their own creative endeavors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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