The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Mar. 28, 2014
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Dow Global Technologies Llc, Midland, MI (US);
Bainian Qian, Newark, DE (US);
Marty W. DeGroot, Middletown, DE (US);
James Murnane, Norristown, PA (US);
Angus Repper, Lincoln University, PA (US);
Michelle Jensen, Newark, DE (US);
Jeffrey J. Hendron, Elkton, MD (US);
John G. Nowland, Elkton, MD (US);
David B. James, Newark, DE (US);
Fengji Yeh, Wilmington, DE (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Dow Global Technologies LLC, Midland, MI (US);
Abstract
A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.