Conshohocken, PA, United States of America

James T Murnane


Average Co-Inventor Count = 7.5

ph-index = 5

Forward Citations = 127(Granted Patents)


Location History:

  • Conshohocken, PA (US) (2013)
  • Norristown, PA (US) (2014 - 2016)

Company Filing History:


Years Active: 2013-2016

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13 patents (USPTO):Explore Patents

Title: The Innovative Contributions of James T. Murnane

Introduction

James T. Murnane is a notable inventor based in Conshohocken, Pennsylvania, with a remarkable portfolio of 13 patents. His work primarily focuses on advancements in chemical mechanical polishing pads, which are essential in various manufacturing processes, particularly in the semiconductor industry.

Latest Patents

Murnane's latest patents include a chemical mechanical polishing pad with a polishing layer and an endpoint detection window. This innovative pad incorporates a plug-in-place window that comprises a reaction product of specific ingredients, including a window prepolymer and a curative system. Another significant patent is for a soft and conditionable chemical mechanical window polishing pad, which features a polishing layer made from a reaction product of a polyfunctional isocyanate and a curative package. This polishing layer exhibits impressive properties, such as a density greater than 0.6 g/cm and a Shore D hardness ranging from 5 to 40.

Career Highlights

Throughout his career, Murnane has worked with prominent companies, including Rohm and Haas Electronic Materials CMP Holdings, Inc. and Dow Global Technologies LLC. His contributions to these organizations have significantly advanced the field of chemical mechanical polishing technology.

Collaborations

Murnane has collaborated with esteemed colleagues, including Bainian Qian and Marty W. DeGroot, further enhancing the innovative efforts in his field.

Conclusion

James T. Murnane's contributions to the development of chemical mechanical polishing pads have made a significant impact on the industry. His innovative patents and collaborations reflect his dedication to advancing technology in this critical area.

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