The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Aug. 30, 2013
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Dow Global Technologies Llc, Midland, MI (US);
Michelle Jensen, Newark, DE (US);
Bainian Qian, Newark, DE (US);
Fengji Yeh, Wilmington, DE (US);
Marty W. DeGroot, Middletown, DE (US);
Mohammad T. Islam, Newark, DE (US);
Matthew Richard Van Hanehem, Middletown, DE (US);
Darrell String, Havre de Grace, MD (US);
James Murnane, Norristown, PA (US);
Jeffrey James Hendron, Elkton, MD (US);
John G. Nowland, Elkton, MD (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Dow Global Technologies LLC, Midland, MI (US);
Abstract
A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.