Location History:
- Wilmington, DE (US) (2015 - 2018)
- Hsinchu, TW (2020)
Company Filing History:
13 out of 309 
10 out of 4,642 
1 out of 23 Years Active: 2015-2020
Title: Innovator Profile: Fengji Yeh
Introduction
Fengji Yeh, an accomplished inventor based in Wilmington, DE, has made significant contributions to the field of chemical mechanical polishing (CMP) technology. With a total of 13 patents to his name, his innovations center around improving the efficiency and effectiveness of polishing processes in semiconductor manufacturing.
Latest Patents
One of Fengji Yeh's latest inventions is a chemical mechanical polishing pad designed for polishing metal surfaces, specifically those containing copper or tungsten in semiconductor wafers. This invention offers methods that utilize a CMP polishing pad with a top polishing surface. This surface is the result of a reaction between an isocyanate-terminated urethane prepolymer and a polyol curative, ensuring a water uptake of 4 to 8 wt. % after soaking in deionized water, ultimately leading to coplanar metal and dielectric or oxide layer surfaces with reduced defects and minimized dishing.
Another notable patent proposed by Yeh outlines a method for creating the polishing layer for the CMP polishing pad, which involves the interaction of liquid components and a pressurized gas in an axial mixing device. The resulting combination solidifies into a cake, from which the polishing layer is derived. The unique groove pattern formed into the surface allows for improved polishing of substrates.
Career Highlights
Fengji Yeh has built a notable career in the materials and chemical industries. He has worked with leading companies such as Rohm and Haas Electronic Materials CMP Holdings, Inc. and Dow Global Technologies LLC. His work in these organizations has focused on developing advanced materials and processes for semiconductor manufacturing, with an emphasis on delivering high-quality and efficient solutions.
Collaborations
Throughout his career, Fengji Yeh has collaborated with esteemed colleagues including Bainian Qian and Marty W. DeGroot. These collaborations have fostered an environment of innovation, contributing to the successful development of several patents and enhanced technologies within the CMP field.
Conclusion
Fengji Yeh stands out as a prominent inventor whose work has significantly impacted semiconductor fabrication processes. With 13 patents highlighting his ingenuity, his contributions to chemical mechanical polishing technology represent a vital advancement in the industry. Through collaborative efforts and a commitment to innovation, Yeh continues to shape the future of materials engineering and semiconductor processing.