The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
May. 24, 2016
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Dow Global Technologies Llc, Midland, MI (US);
Bainian Qian, Newark, DE (US);
Julia Kozhukh, Bear, DE (US);
Teresa Brugarolas Brufau, Philadelphia, PA (US);
David Michael Veneziale, Hatfield, PA (US);
Yuhua Tong, Hockessin, DE (US);
Diego Lugo, Newark, DE (US);
Jeffrey B. Miller, West Chester, PA (US);
George C. Jacob, Newark, DE (US);
Marty W. DeGroot, Middletown, DE (US);
Tony Quan Tran, Bear, DE (US);
Marc R. Stack, Middletown, DE (US);
Andrew Wank, Avondale, PA (US);
Fengji Yeh, Wilmington, DE (US);
Rohm and Haas Electronic Materials CMP Holdings Inc., Midland, MI (US);
Dow Global Technologies LLC, Midland, MI (US);
Abstract
A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ≧10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.